Market
Pump-free liquid cooling for AI chips, high-density semiconductors, and data center modules — passive, reliable, no moving parts.
The Problem
The rapid growth of AI computing has created an acute thermal management crisis. AI chips generate heat densities that air cooling cannot address. Liquid cooling is required — but conventional liquid cooling systems require pumps, tubing, and controllers that add cost, occupy space, and introduce mechanical failure points.
The Surnetics Solution
Surnetics coatings enable liquid to flow through cooling channels purely by surface energy gradient — no pump, no moving parts, no power draw from the cooling system itself.
This approach is uniquely suited to embedded chip cooling, sealed modules, and applications where pump reliability is critical.
Competitive Advantages
The cooling system consumes no electrical power — all fluid movement is driven by the surface energy gradient alone.
Eliminates pump failures, the leading cause of liquid cooling system downtime in data centers and computing environments.
Passive flow enables fully sealed cooling loops with no external connections, tubing, or maintenance access required.
Coatings can be applied at the chip package level, enabling embedded cooling channels directly in semiconductor modules.
Applications Deep Dive
Click any application to explore how precise fluid management determines thermal performance — and how Surnetics technology transforms what is possible.
Full Application Scope
From individual chip packages to full data center cooling infrastructure, passive surface-driven flow eliminates the mechanical complexity of traditional liquid cooling systems.
We are actively seeking licensing partners and co-development agreements in electronics thermal management.
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