03.4 / Industries / THM
Electronics cooling
Liquid cooling loops for chips, power electronics and sealed enclosures, with less riding on the pump.
The problem
Heat density keeps climbing, and liquid cooling is now standard for high-power processors and power electronics. The pump is the part most likely to fail, and it draws power from the system it is supposed to protect.
What we do
We model and build micro-channel cold plates and sealed loops where surface chemistry does some or all of the pumping. Then we engineer the part for the processes that make it at scale: etching, bonding, brazing and coating.
Device types
- THM-01
Processor package cooling
Micro-channels at or near the die
- THM-02
Power electronics
Inverters and converters in sealed housings
- THM-03
Edge and telecom enclosures
Maintenance-free loops in remote sites
- THM-04
LED and laser diodes
Hot-spot management in compact optics
- THM-05
Rack-level loops
Distribution and return without extra pumps
- THM-06
Wafer processing tools
Thermal control in process equipment
Design constraints we plan for
- Copper, aluminum, silicon
- Sealed for life
- Dielectric and water-glycol coolants